Soldering of Components on Printed-Circuit Boards

The solder.balance data frame has 720 rows and 6 columns, representing a balanced subset of a designed experiment varying 5 factors on the soldering of components on printed-circuit boards.

The solder data frame is the full version of the data with 900 rows. It is located in both the rpart and the survival packages.

solder

Format

This data frame contains the following columns:

Opening

a factor with levels L, M and S indicating the amount of clearance around the mounting pad.

Solder

a factor with levels Thick and Thin giving the thickness of the solder used.

Mask

a factor with levels A1.5, A3, B3 and B6 indicating the type and thickness of mask used.

PadType

a factor with levels D4, D6, D7, L4, L6, L7, L8, L9, W4 and W9 giving the size and geometry of the mounting pad.

Panel

1:3 indicating the panel on a board being tested.

skips

a numeric vector giving the number of visible solder skips.

Source

John M. Chambers and Trevor J. Hastie eds. (1992) Statistical Models in S, Wadsworth and Brooks/Cole, Pacific Grove, CA.

Examples

fit <- rpart(skips ~ Opening + Solder + Mask + PadType + Panel,
             data = solder.balance, method = "anova")
summary(residuals(fit))
#>     Min.  1st Qu.   Median     Mean  3rd Qu.     Max. 
#> -13.8000  -1.0361  -0.6833   0.0000   0.9639  16.2000 
plot(predict(fit), residuals(fit))